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copper tungsten electronic package,base plate,heat sink

产品描述

Copper tungsten is the pseudo-alloy who has the advantage of the high thermal conductivity of copper and the low coefficient of thermal expansion of tungsten. It is easy to adjust the CTE( coefficient of thermal expansion)by use the different ratio of copper and tungsten.

copper tungsten heat sink

HOSOPM®0-T is registered trademark of copper tungsten material use for the heat sink application. Our copper tungsten material for heat sink application without the third party elemental added so it has very high density and high thermal conductivity.

 

HOSOPM®T copper tungsten specification:

 

composite

(wt.%)

Density

(g/cm³)

Thermal conductivity (W/m²K)

CTE(10-6/K)

HOSOPM®075T

Cu25W75

14.7

200~230

9.0~9.5

HOSOPM®080T

Cu20W80

15.5

190~210

8.0~8.5

HOSOPM®085T

Cu15W85

16.4

180~200

7.0~7.5

HOSOPM®090T

Cu10W90

17.0

160~180

6.3~6.8

 

HOSOPM®T material metallograph:

Magnification x200 Magnification x1000
copper tungsten metallograph CuW metallograph

HOSOCP®0-T is our registered trade mark for copper tungsten heat thermal management device. From the copper tungsten raw material to the final parts, HOSO offer the one stop serivce .Our copper tungsten heat sink off shelf product got many certificate from our customer.

It is weldly used as the base plate of opto-electronics, high-frequency applications, power electronics and micro-electronics.

off-the-shelf copper tungsten heat sink block:
 

copper tungsten heat sink block
 

copper tungsten heat sink WITH Ni-plating:
 

copper tungsten heat sink WITH Ni-plating

标签:
copper tungsten heat sink
CuW base plate
electrical package flange